Cases Thermaltake Spedo: Innovation in everything! Bashny.Net

It seems that the developers of the company Thermaltake Technology, creating new housing series Spedo, tried to implement all the wildest dreams of the most demanding PC enthusiasts. After all, the representatives of this series have a very impressive and well thought-out design, enviable capacity and functionality, as well as the presence of a powerful system to maintain the optimum temperature located within the PC components.

It should be noted that the judgment of the consumers are offered two versions, namely basic Thermaltake Spedo VI90001N2Z more "advanced» Thermaltake Spedo Advance Package VI90001W2Z, the main technical characteristics are listed below.



Specifications Thermaltake Spedo VI90001N2Z:

• Form Factor: Full Tower;
• Dimensions: 536 x 232 x 610 mm;
• Removable panel: The front and top;
• installed fans: one front TurboFan (size - 140 x 140 x 25 mm, rotation speed - 1,000 rpm, the noise level - 16 dB) and one rear TurboFan (size - 120 x 120 x 25 mm, rotation speed - 1300 RPM per minute, the noise level - 17 dB);
• Optional fans: one above (size 140 x 140 x 25 mm or 120 x 120 x 25 mm), a bottom (size 120 x 120 x 25 mm), one for CPU (size 120 x 120 x 25 mm), one the special variable fan panels (size 120 x 120 x 25 mm) and one on the side wall (size 140 x 140 x 25 mm or 120 x 120 x 25 mm);
• Compatible formats boards: Micro ATX and Standard ATX;
• The number of expansion slots: eight;
• Capacity: up to seven 5, 25-inch devices and up to six 3, 5-inch drives;
• retired outside interfaces, two ports USB 2.0, one port eSATA, two jacks for headphones and microphone;
• Power Supply: Standard ATX PS2 (optional).



Specifications Thermaltake Spedo VI90001N2Z:

• Form Factor: Full Tower;
• Dimensions: 536 x 232 x 610 mm;
• Removable panel: The front and top;
• Features: transparent side panel, the internal structure of Advance Thermal Chamber 3 (ATC3) to separate zones CPU, GPU and PSU in order to organize them better ventilation, cooling concept Fancool 8, innovation 3, 5 HDD Relocation, allowing to change the location of the hard drive and thus removing the obstacles in the path of air flow, as well as an improved system cabling Cable Routing Management 3 (CRM3);
• installed fans: one front TurboFan with red LED backlight (size - 140 x 140 x 25 mm, rotation speed - 1,000 rpm, the noise level - 16 dB), one rear TurboFan (size - 120 x 120 x 25 mm, speed rotation - 1300 rpm, the noise level - 17 dB), a top (size - 230 x 230 x 20 mm, rotation speed - 800 rpm, the noise level of - 15 dB), one TurboFan the special variable fan panels (size 120 x 120 x 25 mm, rotation speed - 1300 rpm, the noise level - 17 dB), and one on the side wall (size - 230 x 230 x 20 mm, rotation speed - 800 rpm, the noise level of - 15 dB) ;
• Optional fans: one from the bottom (size 120 x 120 x 25 mm) and one for the CPU (size 120 x 120 x 25 mm);
• Compatible formats boards: Micro ATX and Standard ATX;
• The number of expansion slots: eight;
• Capacity: up to seven 5, 25-inch devices and up to six 3, 5-inch drives;
• retired outside interfaces, two ports USB 2.0, one port eSATA, two jacks for headphones and microphone;
• Power Supply: Standard ATX PS2 (optional).









That's just about the estimated cost and the likely timing of the massive sales of the above products of their creators yet nothing is said.